Working name: HexTIM-Film (Pilot Series)

Form factor: Master rolls (≈250–500 mm width), sheets (e.g., 300×300 mm), or die-cut parts to drawing (typ. tolerance ±0.2 mm).

Core stack: Vertically aligned SWCNT pathways for through-thickness heat flow + graphene spreader layers for in-plane spreading + engineered surface coupling for low contact resistance.

Nominal thicknesses (pilot): 50 µm, 75 µm, 100 µm, 150 µm (others on request).

Bond line control (options): micro-spacer/BLC layer; pressure-sensitive adhesive (PSA) backing (acrylic; silicone-free variant planned).

Target performance (pilot): low total thermal resistance at practical assembly pressures; full ASTM D5470 curves provided in the data pack (pressure vs. thermal resistance).

Mechanical/handling: thin, conformal, dry-to-touch surfaces; reworkable; supplied with protective release liners.