Quartz Sand – Product Details by Application
1. Glass Manufacturing Grade Quartz Sand
Description:
High-purity silica sand used as the primary ingredient in producing various types of glass.
Typical Specifications:
SiO₂ content: ≥ 99.0–99.5%
Fe₂O₃ content: ≤ 0.03% (low-iron for clear/optical glass)
Particle size: 0.1–0.5 mm (customizable)
Moisture: < 0.5%
Color: White/light beige
Applications:
Container glass (bottles, jars), Flat glass (windows, architectural panels), Solar glass, Optical glass and specialty glass
Key Features:
High purity, low iron content, thermal stability, uniform grain distribution.

2. Foundry Casting Grade Quartz Sand
Description:
High-strength silica sand used in metal casting molds and cores.
Typical Specifications:
SiO₂ content: ≥ 95–98%
AFS fineness: AFS 40–100 depending on casting requirements
Grain shape: Sub-angular or rounded (improves mold compaction)
Refractoriness: ≥ 1700°C
Acid demand value (ADV): Low
Applications:
Iron, steel, and non-ferrous metal casting, Resin-coated sand for precision castings, Green sand molding
Key Features:
High refractoriness, good permeability, low thermal expansion, excellent strength.
3. High-Purity Quartz (HPQ) for Silicon Chip & Solar Panel Production
Description:
Ultra-high-purity silica used in manufacturing polysilicon, monocrystalline silicon, and photovoltaic solar cells.
Typical Specifications:
SiO₂ content: 99.99–99.999% (4N–5N grade)
Impurities: Extremely low (Al, Fe, Ti, Ca, Na, K < 10 ppm)
Particle size: Fine powder or controlled granules (0.05–1 mm)
Color: Pure white
Applications:
Semiconductor-grade silicon, Solar photovoltaic (PV) panels, Fused quartz crucibles, Optical fiber production
Key Features:
Ultra-low impurities, high melting point, chemical inertness, ideal for electronics and energy sectors.

4. Cosmetic & High-Purity Electronics Grade Quartz Powder
Description:
Finely processed silica powder suitable for cosmetics, pharmaceutical formulations, and precision electronic components.
Typical Specifications:
SiO₂ content: ≥ 99.5–99.9%
Particle size: 5–50 microns (customizable)
Surface treatment: Hydrophobic or untreated
Heavy metals: Extremely low levels (Pb, As, Hg, Cd ≤ 1–5 ppm)
Microbial limits: Controlled for cosmetic/pharma use

Applications:
Cosmetic formulations (face powders, exfoliants), Electronic components and encapsulation materials, High-precision polishing (CMP – Chemical Mechanical Polishing), Adhesives, sealants, and coatings requiring purity
Key Features:
Smooth texture, high purity, excellent dispersion, safe for skin contact, enhances product stability.