ForgeSense is an AI-driven Computer-Aided Manufacturing (AI-CAM) platform purpose-built for semiconductor fabs and OSATs. It ingests CAD files, Gerber/ODB++ data, and wafer maps and automatically generates optimized toolpaths and machine recipes for laser dicers, CNC routers, stencil cutters, and substrate machines. Unlike conventional CAM, ForgeSense runs in a closed feedback loop, continuously tuning recipes using SPC/FDC signals and AOI/metrology data.

Core IP (Intellectual Property)

• AI-CAM Engine – proprietary ML algorithms for toolpath and recipe generation, tuned for semiconductor materials (Si, SiC, GaN) and processes (dicing, routing, stencil cutting, marking).
• Closed-Loop Optimization Framework – integration of SPC/FDC sensor streams and AOI/defect maps into adaptive recipe tuning (Bayesian/ML models with guardrails).
• Federated Learning Layer – enables cross-fab learning without exposing sensitive IP, building a global optimization network.
• Process-Aware Data Models – wafer genealogy, job traceability, recipe signing, and compliance aligned with JEDEC, GDPR/NDPR standards.

Defensibility

• Hard to replicate without semiconductor-specific process datasets.
• High switching cost once embedded into fab MES and OEM workflows.
• Patentable innovations in AI-CAM algorithms, SPC/AOI feedback loops, and federated learning for recipe optimization.