Certified Startup
OPSILIN SEMICONDUCTOR PRIVATE LIMITED
Sector:
Electronics and Communication
Business Model:
B2B B2G
Industry:
Manufacturing
Technology:
Semiconductors
About
Incorporation Date
Dec 15, 2025
Incorporation Type
Private Limited Company
Registered State
Kerala
Registered District
Thiruvananthapuram
Registered Address
OPSILIN SEMICONDUCTOR PRIVATE LIMITED, , 134, Remya Bhavan, Karimkada, Chullimanoor, Nedumangad, Nedumangadu, Thiruvananthapuram, Kerala
Office State
Kerala
Office District
Thiruvananthapuram
Office Address
OPSILIN SEMICONDUCTOR PRIVATE LIMITED 134, Remya Bhavan, Karimkada, Chullimanoor, Nedumangad, Thiruvananthapuram- 695541
Team
Divya T S
Co-founder
JUSTIN C DAS
Co-founder
Semiconductor IP
OPSILIN Semiconductor develops indigenous, licensable semiconductor IP blocks and chiplets focused on two of the most performance-critical layers of a modern chip: high-speed connectivity/interconnect and memory subsystems. OPSILIN's flagship product line includes a configurable LPDDR memory controller IP and a UCIe die-to-die digital controller IP.
Sector:
Electronics and Communication
Industry:
Manufacturing
Business Models:
B2B B2G
Technology:
Semiconductors

OPSILIN's IP platform currently comprises two core digital controller products, developed as configurable, reusable IP blocks:

1. LPDDR5X/LPDDR6 Memory Controller IP — Enables high-bandwidth, low-power external DDR memory access for AI accelerator SoCs, high-performance RISC-V SoCs, edge AI processors, industrial and IoT SoCs, and other domain-specific silicon. Key architectural blocks include an AXI4/AXI5-L host interface, a v5.2/6 DFI (DDR PHY Interface), an APB/AXI5-L configuration interface, address mapping, DDR maintenance and RAS (Reliability, Availability, Serviceability) support, a command queue, and an efficient scheduler. The controller is designed with a clean PHY-facing interface, enabling future integration with third-party or partner PHY IP.

2. UCIe Digital Controller IP — Enables die-to-die connectivity for next-generation chiplet-based systems, aligned with the industry's shift from monolithic SoCs to heterogeneous, modular silicon. The first version implements UCIe protocol and adapter layer functionality up to the RDI (Raw Die-to-Die Interface) boundary, focused on streaming-mode data movement, with key blocks including an AXI4 streaming interface, protocol bridge (AXI-to-FDI), and UCIe adapter layer (FDI-to-RDI).

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